| COGNEX Partner System Integrator - 成都新西旺自动化科技有限公司
Product Introduction:
One is used for the identification detection of finished IC packaging, and the detection of defects such as scratches, crushes, dirt, and dents on the six-sided appearance of the finished chip, and can be compatible with a variety of chips.
Application Scenarios:
It is suitable for chip appearance inspection in the semiconductor industry.
Equipment parameters:
Device name | Chip appearance inspection equipment |
Equipment brand | XXW |
Functional use | Detect defects such as scratches, squashes, dirt and dents on the surface of finished chips |
Scope of application | Pouch battery appearance inspection |
Precision | ±0.02mm |
Capacity | 900pcs/H |
Equipment weight | 1000KG |
Overall dimension | 2440mm(L)*1240mm(W)*2100mm(H) |
Equipment maintenance | Provide on-site training, 7×24 hours after-sales maintenance and technical support |
Phone:028-62705808
Fax:028-62705808
Mobile Phone:18215640190
Email:sales@cdxiwang.com
Address:2-8-6, Chen Electric Technology Innovation Park, 68 Shuangbai Road, High-tech West District, Chengdu