Machine vision application chip appearance defect detection

With the continuous innovation of chip technology and chip packaging technology, the chip area and packaging area are developing towards smaller, lighter and thinner, the number of pins increases, the pin spacing decreases, and the difficulty of chip appearance inspection is also increasing. Machine vision inspection of chip appearance defects has incomparable advantages with manual inspection: fast detection speed, high detection accuracy, high detection efficiency, low false positive rate, more objective and reliable, non-contact detection will not cause contact damage to the chip.

The contents of chip appearance defect detection:

The appearance defects of the chip mainly include three aspects, and the machine vision inspection equipment can detect these problems.

1. Chip packaging defect detection, such as scratches, smudges, damage, underfilling, spillage, etc.

2. Printing defect detection, such as typo, offset, missing print, multi-print, blurred, tilt, displacement, hyphenation, double-layer printing, no word mold, etc.

3. Pin defect detection, such as missing pins, broken pins, pin spacing, pin width, pin bending, pin span, pin length differences, pin standing height, pin coplanarity, pin tilt, etc.

If you want to know more about visual inspection solutions and machine vision products (industrial lenses, industrial cameras, vision systems, image grabbers and software processing systems), please call Xinxiwang hotline: 18215640190 to provide you with high-quality solutions and product quotations.